Protruding Ceramic Substrates for High-Voltage Packaging of Wide-Bandgap Semiconductors

2018-07-09T11:18:51+00:00 September 13th, 2017|Power Electronics & Converters, Publications|

With the development of wide bandgap semiconductors, voltage ratings of 10kV and more become realistic. As a consequence, it is now mandatory to propose a suitable packaging. Ceramic-metal substrates are an established technology for voltages up to 3.3kV, but they exhibit some weaknesses for higher voltages.

PhD Ilyas DCHAR “Design of a “fail-to-short” power module for HVDC applications”

2018-07-09T10:25:20+00:00 July 3rd, 2017|Phd, Power Electronics & Converters|

High Voltage Direct Current (HVDC) converters are composed of hundreds of semiconductor switches connected in series to sustain the rated voltage of the converter (several hundred of kilovolts). Because of the large number of switches, it is highly probable that at least one of them will fail during the lifetime of the converter. Such failure should not cause the entire converter to shut down, despite the series connexion of the switches. As a consequence, each switch should be designed so that upon failure, it becomes a short circuit and keeps carrying the current (“fail-to-short” behaviour).

PhD Albert PEREIRA “Design methodology of a medium frequency transformer for high voltage and high power DC-DC converters”

2018-07-09T10:25:03+00:00 July 3rd, 2017|Phd, Power Electronics & Converters|

The transmission and distribution of electric power is normally made by ac networks (50 Hz or 60 Hz), where one of the key elements of this infrastructure is the power transformer; used for more than a century, its design is very well understood, with a level of operating efficiency normally greater than 99%.