Nos publications scientifiques
Fault ride through of dc solid state transformer in MVDC systems
This article introduces the MVDC network fault ride-through (FRT) requirement and the response of a DC solid state transformer is analyzed.
From pole-to-ground fault current return paths in a meshed HVDC network to a grounding modelling simplification for protection studies
This article deals with fault currents return paths in case of pole-to-ground fault in a grounding configuration using surge arresters in all stations except one, which is solidly grounded.
Design and Testing of a Compact Dry Insulated Medium Frequency Transformer Prototype for Medium Voltage Applications
High efficiency and power density for such transformers are the key drivers for applications in datacenter and EV charging.
Design of Oil Insulated SiC Diode Rectifier for an MVDC SST
Integration of the MV and medium frequency diode rectifier in terms of cooling, dielectric design & chemical compatibility, relying on printed circuit board technology.
Anhydride-free epoxy material for HV insulation
This work proposes a new formulation of anhydride free epoxy composite, for HV AC/DC application.
Impact of self-sputtering in high power impulse magnetron sputtering (HiPIMS) with helium
In this paper, we focused on the electrical characterization of the helium magnetron plasma operated at average gas pressure (5 Pa) with a molybdenum target.
New Model-Based Algorithm for Fault Detection and Identification in DC Railway Systems
In this paper, a new model-based Fault Detection Algorithm (FDA) is proposed.
Breakdown Phenomena in Liquid Nitrogen Under Synchronized Transient Boiling and Impulse Voltage
Resistive superconducting fault current limiters constitute a promising solution for high voltage (HV) networks.
Pre-Breakdown and Breakdown Phenomena in Liquid Nitrogen With a Tape–Plane Electrode Geometry
Pre-breakdown and breakdown phenomena are investigated in liquid nitrogen (LN 2) with a tape-plane electrode geometry.
Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches.
A novel packaging approach that suppresses or bal-ances the common mode currents is introduced.
